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Specifications for the 208HRD-180 Large Chamber
High Resolution Sputter Coater

208HRD-180 High Resolution Sputter Coater

Specifications
Sputter head Planar magnetron
Removable, plug in sputter head
Shutter for target conditioning
Targets Cr, Pt/Pd, Ir (see full target list)
Sputter supply Microprocessor based
Safety interlock
Constant current control independent of vacuum
Digitally selectable current (20, 40, 60 or 80mA)
Chamber size 180mm OD (7")
Includes short 65mm chamber. Vertical deposition distances to Rotary-Tilting Stage can be varied by the addition of 15mm tall metal spacer ring, 30mm tall, or combination of both.
Sample stage Rotary-Tilting Stage with variable speed rotation and manual tilt 4" diameter wafer table as standard. Optional Sample Tables are available, accommodating sample sizes up to a 6" wafer.
Analog metering Vacuum Atm - 0.001mb
Current 0-100mA
Voltage 0 – 500V
Control method Automatic operation of gas purge and leak functions
Automatic process sequencing
Digital timer (1-600 sec) with pause
Automatic venting
Thickness control MTM-20 controller with terminating facility

Pumping System
Configuration Turbo/diaphragm backing pump combination
Pumping speed 67 l/sec.
Pumpdown time Approximately 10 min. to 4 x 10-5 mbar
Ultimate pressure Approximately 8 x 10-6 mbar

Thickness Controller
MTM-20 Microprocessor based
4 digit display, push button zero
6MHz crystal with lifetime check
5 times/sec update rate (more information)
Thickness range 0.0 - 999.9nm
Resolution 0.1nm
Density range 0.50 - 30.00gm/cm3
Tooling factor range 0.25 - 8.00
Termination range 0 - 999.9nm

Services Required
Electrical 100-120 or 200-240VAC, 50/60Hz, (please specify)
Power 550VA max.
Argon gas Purity, min. 99.995%
Pressure regulated 5 - 6 psi (0.4 bar)
Hose connection, 6.0mm (1/4") ID hose

System Dimensions
Size Width 600mm (23.6"), Depth 600mm (23.6"), Height 465mm (18.3") (with pump)