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Specimen Preparation Adhesives for Scanning Electron Microscopy
Conductive graphite paint, primarily designed for SEM sample preparation. The graphite flakes, with an average size of 1µm, are bonded by a cellulose resin with isopropanol as diluent. Good bonding properties on most materials. Graphite content is 20%. Ideal to mount samples on sample stubs or to make a conductive path to the sample surface. Let fully dry before using in the SEM. Maximum service temperature: 200° C. Use Graphite Paint Extender to dilute when needed.
Technical Notes, PELCO® Conductive Graphite Isopropanol Based (116KB PDF) F, I - 16053, 16053-20, 16053-SPC SDS (184KB PDF) F, I - 16054 SDS (126KB PDF)
Conductive Adhesives Comparison Table
one component, ready to use; formerly called Electrodag 502
Provides conductivity for SEM non-conductive samples which require grounding.
DAG-T-502 is a combination of specially processed carbon particles in a fluoroelastomer resin system providing good conductivity. This carbon cement remains flexible over a temperature range of -40°C to 260°C and cures at room temperature. 502 resists oxidation and has good adhesion qualities. The diluent is methyl ethyl ketone (MEK) and has fluid consistency. Acetone (#16023) can be used as a thinner/extender or as a cleaner. Solids content is 12.6%. Service temperature range is -40°C to 260°C.
The specimen mount surface should be clean and dry before application. Keep the container tightly capped when not in use and avoid breathing the vapor. PELCO® Technical Notes, Electrodag® 502, 30g (230KB PDF) F, I - 16056 SDS (127KB PDF) F, I - 16023 SDS (122KB PDF)
a reliable conductive ground path for SEM specimens Air drying silver paint to make effective ground. Curable at room temperature and has high adhesion to any material. Surfaces do not have to be prepared prior to application and will adhere to such materials as polymer (phenolic) boards, ceramic, glass, metal, plastic and fiberglass. It should be mixed well with a spatula before using. RoHS compliant. The container is offered in two sizes (15g and 30g) and is provided with an applicator brush. Silver flake grain size is an average of 80%, <1.0µm. Sheet resistance is 0.02 ohms per square @ 1 mil (0.001” = 0.025mm) thickness and is a function of the coating. Service temperature range is -40°C to 200°C. Use #16021 gold/silver thinner/extender to dilute when needed. Technical Notes, PELCO® Colloidal Silver, Product Numbers. 16031, 16034 (417KB PDF) F, I - 16031, 16034 SDS (153KB PDF) F, I - 16021 SDS (PDF 147KB)
a reliable conductive ground path for SEM specimens Leitsilber is fast drying and has a flat surface texture. Silver content 45%, Resistance: 0.02 - 0.04ohms/square. Drying time ~10 minutes at 20°C. Application can be by brush, dipping or spraying. Acetone (#16023) can be used an extender/thinner or as a cleaner to remove the silver paint. Maximum grain size: 16µm Maximum service temperature: 120°C Consumption rate: 0.6 - 2g per 100cm2 Refrigerate for best life. Bring to room temperature gradually F, I - 16035 SDS (121KB PDF) F, I - 16023 SDS (122KB PDF)
replacement for #16045
A highly conductive silver paint with an acrylic binder. High purity silver flakes, fast drying with a low VOC content. The fast drying silver paint forms a thin, highly conductive and flexible layer. Ideally suited to form conductive paths or conductive bonding for SEM sample preparation. Durable acrylic resin minimizes metallic loss, flakes ensure maximum conductivity. Other applications are conductive paths for electronic components and EMI/RFI shielding. Excellent adhesion to most nonconductive materials such as plastics, ceramics, wood, glass, epoxies and most metals. Supplied in a 30g or 15g bottle with brush. Acetone (#16023) can be used as thinner/extender or as a cleaner.
Ideal where a nonflowing paste is needed for special applications. Particle size: 0.4-1.0µm, 80% are below 1.0µm. Cures in 16-20 hours, or 30 minutes @125-150°C. Clear lacquer base. Approximate Specific Gravity 2.25g/cc3. Service temperature = 200°C. Use #16021 gold/silver thinner/extender to dilute if needed.
This very fine flake silver is suspended in iso-butyl methyl ketone (4-methylpentan-2-one) and forms a thin, smooth, highly conductive silver film which is both adherent and flexible. 30g. Fast drying silver suspension has been specifically designed to give increased coverage while maintaining a very high conductivity. Particle size: 5-7µm.
PELCO® Technical Notes, Fast Drying Silver Suspension (355KB PDF) F, I - 16040-30 SDS (129KB PDF) F, I - 16048-25 SDS (160KB PDF) Conductive Adhesives Comparison Table
resistant to oxidation and retains measurement integrity over time Gold paste is fast drying and useful for analytical analysis over time where a high signal is desired. The gold is in microfine form and contains organic binders and a solvent. Dries at room temperature. Not intended for permanent use, but for testing and temporary work. Sheet resistance is .02 to .05 ohm/sq @ 1 mil thickness. Contacts hold down to very low temperatures (<-200°C), but are not permanent since this type of product has low mechanical strength. 75% gold content; sphere size <2µm, flake size <10µm. Maximum service temperature is 65°C. Refrigerate for best life. Bring to room temperature gradually. Approximate calculated specific gravity 3.18g/cm3.
Technical Notes, PELCO® Conductive Gold Paste (74KB PDF) F, I - 16022 SDS (152KB PDF) F, I - 16021 SDS (PDF 143KB) Conductive Adhesives Comparison Table
Silver flakes in an inorganic silicate aqueous solution, specially formulated adhesive for demanding bonding applications such as:
The excellent thermal and electrical conductivity, coupled with the absence of hydrocarbons, makes this product ideal for demanding specimen preparation in FESEM, XPS, ESCA, SIMS, Auger and other applications. PELCO® High Performance Silver Paste provides both high electrical and thermal conductivity with a silver particle size of 20µm. Silver content >60% by weight. Cures at room temperature, but requires a 2 hour cure at 93°C (200°F) to achieve high conductivity and strong bond. Must be fully cured before using this product at cryogenic temperatures. Soluble in water to 260°C (500°F). Above this temperature it becomes almost insoluble. For nonconductive, high temperature adhesive try Product #16026.
Technical Notes, PELCO® High Performance Silver Paste (1.62MB PDF) I - 16047 SDS (114KB PDF)
Carbon flakes in an inorganic silicate solution for bonding resisting up to 2000°C.
The PELCO® High Temperature Carbon Paste is aimed for applications where a conductive cement is needed which withstand temperatures up to 2000°C (3632°F).This paste is ideally suited for mounting specimens on hot stages for SEM , FESEM, XPS, ESCA, SIMS and AUGER systems. Also for applications where silver migration or a reaction with silver or nickel flakes could be a problem, this product would be an excellent alternative. Carbon content is 50-60% by weight in an inorganic silicate aqueous solution. Conductivity in cured state is 4.6 ohm/square/mil. Must be fully cured to achieve good conductivity and strong bond. Soluble in water to 260°C (500°F). Cure schedule is: air dry at room temperature for 2-4 hours, step cure at 93°C (200°F) and final cure at 260°C (500°F).
Nickel flakes in an inorganic silicate aqueous solution providing a conductive adhesive for bonding applications such as:
The good thermal and electrical conductivity of this adhesive, coupled with the absence of hydrocarbons, makes this product suitable for demanding specimen preparation in surface science and SEM applications. Nickel particle size is 20µm, nickel content is >60%. The PELCO® High Performance Nickel Paste needs to be cured for 2 hours at 93°C (200°F) to achieve final electrical and mechanical properties. It is soluble in water to 260°C (500°F), above this temperature it becomes almost insoluble.
PELCO® High Performance Nickel Paste, 16059, 16059-10 Technical Note (360KB PDF) Cg, I - 16059, 16059-10 SDS (109KB PDF)
For nonconductive, high temperature adhesive try Product #16026. For more demanding applications, try PELCO® High Performance Silver Paste.
Conductive nickel paint with an acrylic binder. High purity nickel flakes (8-13µm), fast drying with a VOC content of 27.5%. The fast drying nickel paint forms a thin, conductive and flexible layer with good adhesion on most substrates. Can be used to form conductive paths, conductive bonding or conductive painting where silver can't be tolerated, but where high conductivity is required. The conductivity of this nickel cement paint is approximately 20x better than graphite paint and approximately 10% of silver paint. The high oxidation resistance of pure Nickel ensures a long-term conductivity. Nickel is a magnetic material, not suitable for high resolution SEM imaging close to the pole piece in most SEMs. Supplied in a bottle with a brush, 30g. Acetone (#16023) can be used as thinner/extender or as a cleaner to remove the nickel paint.
PELCO® Conductive Nickel Paint Technical Note (225KB PDF) Cg, I, F - 16055 SDS (215KB PDF) F, I - 16023 SDS (122KB PDF)
Bonderite L-GP formerly known as Aerodag® G; same product now with new label
Excellent lubrication properties when sprayed on surfaces or in mechanisms such as locks, sliders and hinges. Works well on most plastics. Can be used in vacuum systems when dry.
Other applications are conductive spray for non-conductive SEM specimen to enable imaging at low magnification and making plastics conductive for plating. Sold in 10 oz. (284g) spray can.
carbon base, good conductivity, large specimens Leit-C-Plast™ is a conductive adhesive paste that can be molded to provide conductive paths to larger non-conductive samples when mounted on a specimen holder for SEM studies. The plasticity is permanent. It is not affected by high vacuum conditions and shows no peaks in energy dispersive X-ray microanalysis.
Heavy specimens may also be prepared for viewing in a SEM using Tempfix™ (or the Glue Gun - see details in our non-conductive section) and Leit-C-Plast™. First the specimen is fixed into place with Tempfix™ or the Glue Gun. Afterward, an electrically conductive bridge is made between specimen mount and specimen using Leit-C-Plast™. It is not required to wait for drying because neither adhesive outgasses. Leit-C-Plast™ was originally developed for holding specimens on angled specimen holders. The adhesive is offered in a roll form and is black. Flat plates are provided for working the material. May be applied with a spatula.
General Properties 100% solids, two component silver filled epoxy with a soft, smooth, thixotropic (becoming less viscous when stirred or shaken) consistency designed specifically for chip bonding in microelectronic and optoelectronic applications.
Two component, silver-filled epoxy system, consisting of a silver resin paste and a liquid hardener (100:4.5). It is a free flowing paste, 100% solids system characterized by outstanding high temperature properties as well as excellent solvent, chemical and moisture resistance. It has a long pot life and is fast curing at relatively low temperatures. Containing no solvents or thinners; it will not outgas. It can be applied by brush, spatula or hypodermic needle. H-22 can be useful for small angle cleavage in material science and semi-conductor applications. EPO-TEK® silver content is 60% by weight of composition.
NASA approved – passes NASA low outgassing standard ASTM E595 with proper cure. Ref: http://outgassing.nasa.gov.
Note: Mixing ratio for this product is 100 parts silver resin paste to 4.5 parts liquid hardener. Cure Schedule (minimum bond temperature/time) 150°C .........5 minutes 120°C .......10 minutes 100°C .......20 minutes 80°C .......45 minutes
Properties:
Technical Notes, H-22 EPO-TEK® Silver Conductive Epoxy (160KB PDF) F, I - 16016 SDS (214KB PDF) Guide to working with Epoxies (2MB PDF) Conductive Adhesives Comparison Table Reworking Cured Epoxy (185KB PDF)
Two component, silver filled, epoxy system consisting of a silver resin paste and a silver resin hardener (1:1). It is a smooth, thixotropic paste, 100% solids system characterized by outstanding high temperature properties and excellent solvent, chemical and moisture resistance. It has a long pot life and is fast curing at relatively low temperatures.
Will withstand 200°C for 1,000 hours. Containing no solvents or thinners, it will not outgas. H20E is ideal for electronic applications. Cures rapidly. Easy to use; the pure silver powder is dispersed in both the resin and the hardener so that it can be used in a convenient 1:1 mixing ratio. Non-toxic – complies with USP Class VI Biocompatibility standards.
• Color: bright silver • Consistency: smooth, thixotropic paste • Sheet resistance: .16 ohms/sq/mil • Continuous Operating temperature: 200°C • Degradation Temperature: 410°C • Refrigeration not required. • Low Viscosity (2000cps) Technical Notes, H20E EPO-TEK® Silver Conductive Epoxy (198KB PDF) F, I - 16014 SDS (217KB PDF) Guide to working with Epoxies (2MB PDF) Conductive Adhesives Comparison Table Reworking Cured Epoxy (185KB PDF)
High purity, high density fine conductive powders for making conductive adhesives or embedding materials. Can be mixed with epoxies or for making conductive embedding material or conductive cement. Can also be mixed with cyanoacrylate gel for a super fast drying, conductive adhesive to mount specimens. Available as silver, carbon (graphite), and nickel powder.
Strong, highly conductive epoxy for solderless connections and repairs of circuit boards, static discharge shielding, grounding and conductive paths. Cure Schedule (Minimum bond temperature/time) 65 to 121°C (150 to 250°F) for 5 to 10 min. 25°C (75°F) for 4 hours Properties:
Service temperature range -91°C to 100°C (-132°F to 212°F) permanent bond. 0.4 ohms/sq/mil (25µm)
Technical Notes, Silver Conductive Epoxy(40KB PDF) 16043 SDS Part A (119KB PDF) I - 16043 SDS Part B (122KB PDF) Conductive Adhesives Comparison Table
This conductive silver-coated aluminum filled grease provides high electrical and thermal conductivity between two surfaces. It also exhibits excellent lubrication properties and superb chemical resistance. Typical applications include lubrication of vacuum transfer rods (airlock on SEM), static grounding on seals or O-rings, heat dissipation and lubrication of switches and circuit breakers. Paste like consistency. Service temperature range is -70°C to 200°C (-94°F to 392°F). Packaged as a 5.6g syringe for easy application.
16052 SDS (PDF 132KB)
Pen leaves a mark which does not charge and can be read under the electron beam in the SEM. Its carbon ink has a relatively high resistance and is most useful for marking or identifying objects.
Draws highly conductive silver traces, jumpers and shielding with high precision.
Technical Notes, Silver Conductive Pen (89KB PDF) 16041, 16042 SDS (163KB PDF)
Circuit Scribe silver conductive ink pen can be used on any surface a rollerball pen can write on. Typical resistance of 1ohm/cm. Dries approximately within a minute or two. Can draw 60-200 meters depending on writing surface and speed. Non-toxic.