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Precision Topside Scribing for all Materials
The PELCO® FlexScribe™ (formerly from LatticeGear™) is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe. This system is used to scribe a wide variety of materials without restrictions on shape, including glass slides, coverslips, silicon, III-V, sapphire and other crystalline and brittle materials. It can address very small samples down to 5mm up to 200mm wafers for the #54340 model, and up to 300mm wafers for the #54342 model.
The standard tungsten carbide cutter installed on the PELCO® FlexScribe™ is great for a wide variety of samples including silicon, glass, GaAs and other crystalline materials. Diamond and deep-cutting scribing wheels are also available.
Indenter recommendations:
#54346 Tungsten carbide scribing wheel is good for general purpose use. #54343 Diamond cutter for very thin glass, tempered glass and hard materials such as sapphire. #54344 Deep cutting wheel, for applications like thick glass or off-axis cleaving.