| Home Page | Abbreviated Contents | Customer Login | Quick Order / View Order | |
|---|---|---|---|---|
| Contact Us | Search | Indexes | Finish Order | |
|
Adhesive TabsComposed of a thin film of strong nonconductive adhesive. Size of adhesive area is 11mm 7/16" (11mm) diameter which is appropriate for 1/2" SEM pin and cylinder mounts. Place the press portion of the tab on a SEM mount surface. After pressing, pull tab up and a thin layer of adhesive is left on the mount surface. Contents: 72 sheets, total of 2,592 tabs. Nonconductive |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() adhesive being applied to a specimen mount using Lift-N-Press
|
Lift-N-PressA new, improved adhesive tab composed of a thin film of strong, nonconducting, 1/2" (12.7mm) diameter adhesive which has these properties:
|
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Tempfix Adhesive Specimen Mount Setexcellent for particulate specimens such as powders, particles, pollens, insects, dried samples and similar fine matter |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Tempfix is a non-conductive thermoplastic hot melt adhesive resin, especially formulated for SEM studies.
It does not contain solvents and is stable under high vacuum. It's adhesive characteristics appear in the 40-120°C
range. Melting starts at 40°C and it becomes a thin fluid at 120°C, displaying a wide viscosity range. It has a
very smooth surface and can be used in SEM imaging without interfering background. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MikrostikUltrathin sticky base, clear, suitable for small particles which are submerged by other adhesives. Applications cited include organic powders, pollen, seeds - for attachement to a SEM stub. Can be diluted with MEK. Dries quickly. Nonconductive.MSDS |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Aron Alphaindustrial Krazy Glue®
No mixing, no heat, dries clear. Contains no solvent. Not affected by solvents, except ketones. Hazardous, read
instructions. Nonconductive. Methyl 2-Cyanoacrylate Used when metal is one of the bonding components, such as metal to plastic, metal to rubber, glass, etc. MSDS |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Ethyl Ultra Speed Type 221 Ethyl 2-Cyanoacrylate The fastest drying cyanoacrylate made (3-10 sec.). Used in high speed gluing or assembly operations and for superior wicking. Viscosity 2 cps. MSDS
Ethyl White Cap® Type 201 Same as 14450 ("Krazy Glue®") Bonding any combination of plastic, rubber, ceramic or glass. Metal bonds with a modest decrease in bond strength. Viscosity 2 cps, set time 5-20 seconds. MSDS
Ethyl Blue Cap® Type 202 Same as 14430, Type 221, but with setting time slowed one-half to one-third (10-60 sec.). Added time for positioning components or to apply to large surface areas. Viscosity 100 cps. MSDS
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Krazy Glue® PenNo mixing, no drip, no clogged tips. Contains cyanoacrylate
adhesive; comes out one drop at a time. Bonds in seconds. |
|||||||||||||||||||||
|
|
||||||||||||||||||||||
|
Duco® Cement
Dries fast, clear, tough. For china, glass, wood, metal, leather.
Contains acetone and butylacetate solvents. Nonconductive. |
|||||||||||||||||||||
|
|
||||||||||||||||||||||
|
Super Fast EpoxySuper fast 2-part epoxy resin cement for bonding applications. Sets in minutes.
Full bond overnight. Stick polymerized specimens on aluminum Specimen Slug Mounts.
Will not dissolve in acetone or alcohol. Dual dispersing syringe. |
|||||||||||||||||||||
|
|
||||||||||||||||||||||
|
Loctite® Quick-SetVibratome®, Microslicer applications and other quick-set tissue-slide uses.
|
|||||||||||||||||||||
|
Loctite® 460 Sample Bonding AdhesiveLocktite® 460 is a fast curing thin glue which can be used as an alternative to wax for mounting samples to glass for TEM/FIB Thinning. Soluble in acetone.
|
|||||||||||||||||||||
|
Epoxy Bond 110Epoxy Bond 110 is a very low viscosity, hard and fast-curing epoxy with excellent bonding characteristics. A unique feature of Epoxy Bond 110 is the red color that appears on curing. Cure by color instead of time. It is a reactive system only when heat is applied. It has good adhesion to many materials including metals, ceramics, glass and most plastics. Use for IC Cover Slip Technique when IC does not have passivation layer, when rounding occurs during cross-sectioning, or for in semiconductor field bind pad protection. |
|||||||||||||||||||||
|
||||||||||||||||||||||
|
Poxy Pak
fast cure epoxy, dual eject syringe |
|||||||||||||||||||||
|
|
||||||||||||||||||||||
|
M-BOND 610 Adhesiveion milling, cross-sectioning |
|||||||||||||||||||||
|
Operating temperature range, short term is -269° to +370°C; long term, -269° to +260°C.
Elongation can occur at +24°C (3%). This may be the widest temperature range general-purpose adhesive that is available. A kit contains: 4 bottles (14g each) Resin, 4 bottles (11g each) Curing Agent, 4 brush caps for dispensing mixed adhesives, 4 disposable mixing funnels and instructions. M-BOND Adhesive MSDS; M-BOND Adhesive Curing Agent MSDS
|
||||||||||||||||||||||
|
3M Multipurpose Adhesive
MSDS (PDF/37KB) |
|||||||||||||||||||||
|
|
||||||||||||||||||||||
|
Glue Gun
low temperature model |
|||||||||||||||||||||
|
A thermoplastic glue stick is used with a gun-type design to melt the glue and allow its application, for example, to an SEM specimen mount. Heavier and/or larger specimens, which might move during study when held with a tape or disc adhesive, will hold firmly in place when this type of adhesive is used to "seat" the specimen. Carbon coating the specimen and the adhesive will permit an electrical discharge path. A lower temperature range (100° to 120°C / 212°- 248°F) is preferable, such as our model 16068 to avoid possible damage to heat sensitive specimens. (Normal temperature for standard high temperature glue guns is in the 190° to 210°C / 374° to 410°F range) The glue hardens quickly so the specimen should be positioned promptly upon glue application. If re-positioning is required, the glue may be softened with the Glue Gun.
References: |
||||||||||||||||||||||
Privacy Policy |